Insulating substrates for high temperature power electronics are in the focus of this paper. The targets were 200 °C ambient temperature (base plate) and 300 °C junction temperature for the use of silicon carbide devices. DBA and DBC were tested if they are suitable to reach this target. A comparative temperature cycling test under extreme conditions was done. Standard DBC substrates with alumina ceramic withstand only a few cycles. The first idea that higher mean temperatures will increase the temperature cycling capability could not be confirmed. DBA substrates have a very high temperature cycling capability, more than one order of magnitude higher compared to standard DBC. There is a totally different failure mechanism. The surface get rough. There was no optical influence on the die attach quality.
Reliability of insulating substrates - High temperature power electronics for more electric aircraft
2011
7 Seiten, 6 Quellen
Aufsatz (Konferenz)
Englisch
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