Insulating substrates for high temperature power electronics are in the focus of this paper. The targets were 200 °C ambient temperature (base plate) and 300 °C junction temperature for the use of silicon carbide devices. DBA and DBC were tested if they are suitable to reach this target. A comparative temperature cycling test under extreme conditions was done. Standard DBC substrates with alumina ceramic withstand only a few cycles. The first idea that higher mean temperatures will increase the temperature cycling capability could not be confirmed. DBA substrates have a very high temperature cycling capability, more than one order of magnitude higher compared to standard DBC. There is a totally different failure mechanism. The surface get rough. There was no optical influence on the die attach quality.


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    Titel :

    Reliability of insulating substrates - High temperature power electronics for more electric aircraft


    Beteiligte:
    Schletz, A. (Autor:in) / Nomann, M. (Autor:in) / Rauch, M. (Autor:in) / Kraft, S. (Autor:in) / Egelkraut, S. (Autor:in)


    Erscheinungsdatum :

    2011


    Format / Umfang :

    7 Seiten, 6 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch





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