Typical power electronic applications in transportation are inverters, which require a compact, weight optimized and robust packaging in order to constitute an added value. We present a design approach which features a low pressure loss in liquid cooling, and a printed circuit board assembly which enables effective thermal management and EMC. Thermal simulations and experimental results for the board assembly and for a pin-fin based cooling channel are presented.


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    Titel :

    Compact PCB-packaging and water cooling of a 25-kW inverter


    Beteiligte:
    Munding, A. (Autor:in) / Thoben, M. (Autor:in) / Hong, T. (Autor:in) / Nold, M. (Autor:in) / Kerkhoff, M. (Autor:in) / Mongui, E. (Autor:in) / Lutz, S. (Autor:in)


    Erscheinungsdatum :

    2010


    Format / Umfang :

    6 Seiten, 13 Bilder, 4 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Datenträger


    Sprache :

    Englisch




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