Kissing bond detection has been a challenging issue for NDE of bonded structures in aeronautical industry. A novel impact test technique for bond inspection has been developed, which shows great potential for kissing bond detection. The impact test employs a solenoid to produce impact forces in a bonded structure, and the induced elastic wave in the structure was picked up by an EMAT sensor, which located side by side with the solenoid. Both solenoid and EMAT sensor are integrated into a tap header that is mounted onto an automatic 2-D scanner to realize an automatic 2-D scanning. Multiple samples with artificial defects including kissing bonds and disbonds were used to test the impact test technique. The results show that those bond defects in the samples can be detected by the developed impact test technique. For comparison purpose, those samples were also tested with traditional ultrasonic C-scan.


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    Titel :

    Bond inspection by impact test


    Weitere Titelangaben:

    Prüfung von Bindungen mittels Schlagversuch


    Beteiligte:
    Yang, Y. (Autor:in) / Xiang, D. (Autor:in) / Qin, Y. (Autor:in) / Li, F. (Autor:in) / Coulter, R.V. (Autor:in)


    Erscheinungsdatum :

    2009


    Format / Umfang :

    8 Seiten, 10 Bilder, 6 Quellen




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Datenträger


    Sprache :

    Englisch







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