The opportunities to integrate more and more functionality into a (micro) system-in-a-package (SiP) heavily call for advanced methodologies in modeling and simulation for complete systems. The model setup has been simulated using 12 tests and related 12 embedded test programs. Virtually the complete functionality of the product can be assessed in its environment. These simulations turned out to be a cornerstone in the SiP-verification, as they helped to avoid a redesign. The simulation speed is in the range of 20 CPU-minutes per second real-time, which allows to accomplish extensive verification runs. The limitation of this kind of simulations lies in the fact, that only those effects are taken into account, which have been introduced into the models. The shown drive system served as a demonstrator to assess the opportunities of complete system simulations. With that, the neuralgic scenarios can be assessed before tapeout of the chips. Even more, the complete controllability and observability of a simulation helps a lot in quickly tracking down the problems.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Simulating microsystems in the context of an automotive drive application


    Beteiligte:
    Pelz, G. (Autor:in) / Decker, C. (Autor:in) / Metzner, D. (Autor:in) / Voßkaemper, L. (Autor:in)


    Erscheinungsdatum :

    2006


    Format / Umfang :

    9 Seiten, 4 Bilder, 1 Tabelle, 6 Quellen




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch





    Microsystems for automotive engineering

    Mamut, E. | SAE Technical Papers | 2001


    Microsystems packaging for automotive applications

    Jung, E. / Wiemer, M. / Grosser, V. et al. | Tema Archiv | 2002


    Microsystems Packaging for Automotive Applications

    Jung, E. / Wiemer, M. / Grosser, V. et al. | British Library Conference Proceedings | 2002