Automotive electronics have to withstand harsh environmental loads, such as temperature, humidity and vibration. In contrast to standardized life tests, the loads are superimposed with varying intensities and durations. A way to predict the life-cycle of an electronic product starts with the acquisition of field loads of the unit under operation. The time-to-failure of the product can be calculated from the analyzed and rated field data using damage models derived from lifetime and reliability tests under standardized conditions. The reliability of electronic assemblies is mainly determined by the local strains in the solder connections of the packages. Unless no measurement principle is available, in-situ strains in the solder connection due to the environmental loads have to be simulated using finite element models. The measured field loads, e.g. the temperature profile, serve for the FE-calculations as simulation constraints. For the first time, a test-chip in a commercial LFBGA-package has been assembled on an automotive electronic control unit (ECU) for field data acquisition. The sensor measures the local strains close to the solder connections of the package itself. This paper describes the development and test results of a mobile data acquisition and sensors system for field loads. The selected devices provide temperature, humidity, acceleration and stress/strain sensing in an automotive electronic control unit from under the hood. A combination of commercial sensors and a strain-sensitive test-chip, which was developed at the IMTEK and integrated in a commercial LFBGA-package, were used for the measurements. The data acquisition system consists of the different measurement devices connected to a laptop computer for data logging. The comprehensive set of physical values allows extensive postprocessing and also correlation between different analyses. Furthermore, a validation of simulation results of the electronic package for reliability prediction is possible by the comparison with dependent local loads like the measured strain in the electronic package.


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    Titel :

    In-situ analysis of field loads in automotive electronics using MEMS sensors and a mobile data acquisition system


    Weitere Titelangaben:

    In-situ-Analyse von Betriebsbelastungen der Kraftfahrzeugelektronik mit Hilfe von MEMS-Sensoren und einem mobilen Datenerfassungssystem


    Beteiligte:
    Pustan, David (Autor:in) / Fischer, Andreas (Autor:in) / Wilde, Jürgen (Autor:in)


    Erscheinungsdatum :

    2007


    Format / Umfang :

    6 Seiten, 7 Bilder, 3 Tabellen, 4 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Analysis of field loads in automotive ECUs and MEMS sensors

    Pustan, D. / Fischer, S. / Wilde, J. | Tema Archiv | 2007


    Automotive electronics-sensors

    Igarashi, I. | Tema Archiv | 1989


    MEMS for Automotive and Consumer Electronics

    Marek, Jiri | Tema Archiv | 2010


    Automotive sensors with integrated electronics

    Kleinert,G. / Vetter,E. / VDO,Schwalbach,DE | Kraftfahrwesen | 1987