In this paper the authors present the results of power cycling tests of transfer molded, DCB based power components at temperature swings up to 155 K. The results are statistically analysed. The DCB based transfer molded components show at high temperature swings a higher power cycling capability than standard modules with base plate. They promise to fulfil the Automobile standard AEC-Q101 at Delta T(j)>130 K. Regarding to the analysis of the components after test, supported by the end-of-life failure mode of the tests at Delta T(j)=130 K and Delta T(j)=155 K, one can assume that the compound material decelerates the bond wire lift off which clarifies the high power cycling capability of the assembly technology. The Weibull analysis shows a satisfactory distribution of the end-of-life failure meaning that the failure mechanism is well defined.
Evaluation of a DCB based transfer molded component with high temperature swings
2004
5 Seiten, 12 Bilder, 7 Quellen
Aufsatz (Konferenz)
Englisch
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