Conductive Surface Mount Adhesives (CSMAs) are on alternative to traditional solders used in the electronics industry. CSMAs provide on environmentally friendly alternative to conventional Sn/Pb metal solders offering additional attractive technical advantages including low temperature processing, fine pitch capability and better resistance to thermal cycling. Traditionally CSMAs have been used in hybrid applications. These applications typically use noble metallisations such as gold and silver palladium on ceramic substrates. The major limitation of CSMAs has been their instability on common electronic metals such as copper and Sn/Pb solder. Recently, CSMAs have been re-evaluated in applications that were traditionally reserved for solders. The reason for this renewed interest can be attributed to the development of adhesives with stable contact resistance in combination with non-noble metals. Data on the effect of eutectic tin lead and 100% tin terminations on the new technology CSMAs will be presented.


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    Titel :

    Solder alternative electrically conductive adhesives with stable contact resistance in combination with non-noble metallisations for automotive electronic assembly


    Weitere Titelangaben:

    Elektrisch leitende Verbindungen als Alternative zum Lötverfahren mit stabilem Kontaktwiderstand in Verbindung mit nichtedlen Metallen zum Einsatz in der Kfz-Elektronik


    Beteiligte:
    Dreezen, G. (Autor:in) / Luyckx, G. (Autor:in)


    Erscheinungsdatum :

    2003


    Format / Umfang :

    10 Seiten, 8 Bilder, 1 Tabelle, 9 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch






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