The LIN bus is now in demand for automotive applications. It is in extension to the established CAN network an appropiate bus topology for subbus systems mainly in the body area of the car. There are three grades of integration. A discrete construction with a microcontroller, voltage regulator (VR), LIN transceiver (LIN) and separate surveillance circuit (SC). A higher integration level integrates the VR, LIN and SC on one single system basis chip and combine it with an enhanced LIN microcontroller. This is a two chip solution. The highest integration uses flip chip dies on a substrate and is well suited for mechatronics solutions in connectors. The main advantage of the distributed architecture of a LIN network is the reduction of cabling and the possibility of an enhanced function extension.


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    Titel :

    Anwendungen des LIN-Busses im Automobil


    Beteiligte:
    Kreidl, H. (Autor:in)


    Erscheinungsdatum :

    2002


    Format / Umfang :

    7 Seiten, 6 Bilder



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Deutsch




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