We are developing a novel 2-dimensional focal plane array (FPA) with read-out integrated circuit (ROIC) on a single chip for 3 dimensional (3D) laser radar (ladar) imaging. The ladar will provide high-resolution range and range-resolved intensity images for detection and identification of difficult targets. The initial full imaging-camera-on-a-chip system will be a 64x64 element, 100 mu m pixel-size detector array that is directly bump bonded to a low-noise (30 electrons) 64x64 array silicon CMOS-based ROIC. The architecture is scalable to 256x256 or higher arrays depending on the system application. The system will provide all the required electronic processing at pixel level and the smart FPA enables directly producing the three-dimensional (angle-angle-range) or four-dimensional (angle-angle-range-intensity) format data to be captured with a single laser pulse. The detector arrays are made of uncooled InGaAs PIN device for SWIR imaging at 1.5 mu m wavelength and cooled HgCdTe PIN device for MWIR imaging at 3.8 mu m wavelength. We are also investigating concepts using multicolor detector arrays for simultaneous imaging at multiple wavelengths (active-active and active-passive) that would provide additional spectral dimension capability for enhanced detection and identification of deep-hide targets. The system is suited for flash ladar imaging, for combat identification of ground targets from airborne platforms, flash-ladar imaging seekers, and autonomous robotic/automotive vehicle navigation and collision avoidance applications.
Adaptive LADAR receiver for multispectral imaging
2001
8 Seiten, 6 Quellen
Aufsatz (Konferenz)
Englisch
Cadmiumlegierung , komplementäre MOS-Schaltung , Bildsensor , Brennebene , Galliumarsenid , Indiumverbindung , Quecksilberlegierung , Laserradar , Lichtempfänger , Photodiode , Radarabbildung , Spektralanalyse , Tellurlegierung , Zielerkennung , Silicium , Indium-Gallium-Arsenid , Quecksilbercadmiumtellurid , Kollisionsschutz , 2-Mikrometer-Bereich
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