Mostly failures of electronic components in humid atmospheres are caused by electrochemical migration and leakage currents. The reduction of the conductor spacing inhances danger of a fall out by short cuts especially affects sensors and control circuits in stand by modulus. With the paper electrochemical migration consisting of different steps as metal solution, metal diffusion and metal deposition are described. The influence by the type of metallisation and operating voltage will be stated. The type and concentration of contaminants mostly caused by flux residues determines the chemical composition of the bridges. Leakage currents arise with air pollution, especially of sulphurdioxid. Imperfections of the solder mask like cracks and delaminations form crevices induced corrosion. The Gemini SEM enables now to proof the leakage path even when there exist only remains of very thin films. Furthermore, it is possible to analyse the chemical composition of the released salt bridges.
Humidity and pollution effects on electronic equipment
1999
6 Seiten, 3 Bilder, 7 Quellen
Aufsatz (Konferenz)
Englisch
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