Packaging Technology developments have been an important part of the success of the Computer Industry's ability to provide ever increasing cost effective performance and reliability in information processing. This paper will review the product and technology development history of one aspect of system packaging, the first level package or module. The IBM Ceramic Module History will be used to illustrate product, material, and process developments of the past several years.


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    Titel :

    Electronic packaging module evolution from a material and process perspective


    Weitere Titelangaben:

    Entwicklung von elektronischen Kompaktbaumodulen aus der Material- und Fabrikationsperspektive


    Beteiligte:
    Lussow, R.G. (Autor:in)


    Erscheinungsdatum :

    1984


    Format / Umfang :

    8 Seiten, 24 Bilder, 13 Quellen


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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