Electronic components will generate heat in the process of operation, and the heating power consumption of components will gradually increase with the decrease of volume. With the volume miniaturization and integration, the heat flux will continue to increase. Therefore, in order to ensure the reliability of electronic components, heat dissipation treatment must be carried out, and heat pipe cooling is one of the effective methods. For the structure design of heat sink with heat pipe, this paper uses an improved particle swarm optimization algorithm to reduce the maximum temperature at the bottom of heat sink by optimizing the length and number of fins and the number of heat pipes. At the same time, the designed heat sink is used for heat dissipation of high power LED, and the experimental results show that it can fully meet the requirements of LED heat dissipation in practical application.
Heat Dissipation with Heat Pipe Using Particle Swarm Optimization and Being Used for High Power LED
Lect. Notes Electrical Eng.
International Conference on Electrical and Information Technologies for Rail Transportation ; 2021 October 21, 2021 - October 23, 2021
Proceedings of the 5th International Conference on Electrical Engineering and Information Technologies for Rail Transportation (EITRT) 2021 ; Kapitel : 14 ; 127-134
2022-02-19
8 pages
Aufsatz/Kapitel (Buch)
Elektronische Ressource
Englisch
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