Automotive electronics is among the fastest growing segments of semi-conductor industry (https://www.pwc.com/gx/en/technology/publications/assets/pwc-semiconductor-survey-interactive.pdf). It is primarily driven by increasing dependence on advanced electronics for a wide range of functions such as safety, control, and driver assist. The critical-to-function Advanced Driver-Assist System (ADAS) must meet stringent reliability and thermal requirements while providing high-performance deterministic compute. This chapter will cover the packaging technologies employed to meet the lifetime performance, quality, and reliability demands of automotive applications, as well as the system packaging and thermal management strategies for control units that dissipate between 10 and 500 W of power depending on the application. The high operating ambient temperatures for passenger vehicles can range from 65 to 85 °C, and this influences the choice of thermal solution ranging from low-power fan-less designs, mid-power forced-air designs to high-power liquid-cooled solutions. While significant innovations in technology for in-vehicle infotainment to autonomous driving are happening today, more are required in the near future to translate into reality the visions of automobile design that will revolutionize the auto industry and more broadly the way we live.


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    Titel :

    Overview of Packaging Technologies and Cooling Solutions in ADAS Market


    Beteiligte:
    Li, Yan (Herausgeber:in) / Shi, Hualiang (Herausgeber:in) / Sane, Sandeep (Autor:in) / Tandon, Shalabh (Autor:in) / Ewy, Erich (Autor:in) / Maynez, Luisa Cabrera (Autor:in)


    Erscheinungsdatum :

    2022-10-28


    Format / Umfang :

    33 pages




    Medientyp :

    Aufsatz/Kapitel (Buch)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch




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