This chapter provides the technical description of the system’s I/O-Boards and the CCSDS-Boards for telecommand decoding and telemetry encoding. The approach for these two OBC components is a common design for the printed circuit boards of both board types, just with differing chip population. Both of these board types are available with singleredundancy inside the OBC and are connected to the two OBC Processor-Boards via cross coupled SpaceWire links running RMAP protocol. A key characteristic is that although implementing completely different functionalities both boards are based on the same 3U printed circuit board, FPGA chip and I/O driver ICs design.
The I/O-Boards
Springer Aerospace Techn.
2013-06-14
16 pages
Aufsatz/Kapitel (Buch)
Elektronische Ressource
Englisch
Springer Verlag | 2022
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