In most of the electronic devices, heat transfer is one of the major criteria which affects the performance of the devices for an application. As efficient cooling of the electronic devices becomes a challenging task in thermal fields, these systems should be self-indulge to improve its reliability and failure. Heat sink is an element for heat exchange that cools a device by its extended surfaces. Heat sink is made of metal such as copper or aluminium alloys or a mixture of different materials such as FGM. These are attached on the top of processor. Functionally graded materials (FGMs) are inhomogeneous materials, consisting of two or more different types of material, tailored to have a continuously varying spatial composition profile. These materials are generally made from a mixture of ceramics and metal or it can be a combination of different types of materials. In this paper, evaluation of heat sink is carried to determine the thermal efficiency and thermal analysis is carried out using Ansys software. Latter, obtained experimental data are compared with the analytical data and the performance of the heat sink is validated.
Evaluation of Heat Transfer Rate in Heat Sink Using FGM
Lect.Notes Mechanical Engineering
2022-03-02
19 pages
Aufsatz/Kapitel (Buch)
Elektronische Ressource
Englisch