IC manufacture often has to meet stringent requirements pushing the imaging tools beyond their limits. Selection and optimization of steppers used to image patterns with critical dimensions at a fraction of wavelength has to consider tool’s aberration residue and the imaging tradeoffs of the patterned features. This report presents methodology to select tool-specific, multi-feature optima for imaging tools performing beyond their design points.
Wavefront-based tool selection for critical level imaging
Optical Microlithography XVIII ; 2005 ; San Jose,California,United States
Proc. SPIE ; 5754
2004-05-12
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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