IC manufacture often has to meet stringent requirements pushing the imaging tools beyond their limits. Selection and optimization of steppers used to image patterns with critical dimensions at a fraction of wavelength has to consider tool’s aberration residue and the imaging tradeoffs of the patterned features. This report presents methodology to select tool-specific, multi-feature optima for imaging tools performing beyond their design points.


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    Titel :

    Wavefront-based tool selection for critical level imaging


    Beteiligte:

    Kongress:

    Optical Microlithography XVIII ; 2005 ; San Jose,California,United States


    Erschienen in:

    Erscheinungsdatum :

    2004-05-12





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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