When utilizing induction heating for curing adhesives to obtain quick handling strength, heating the complete bond line is the accepted and proven process. Challenging this process is the induction spot curing (partial cure of the bond line) process. This paper will analyze the strength of the induction spot curing process, and compare it to the strength attained when we induction cure the entire bond line. Both one and two component adhesives, as well as metal and plastic substrates, will be examined. Examples and application advantages of both processes will also be presented.


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    Titel :

    Strength Analysis of the Induction Spot and Full Bonding Processes


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    International Congress & Exposition ; 1990



    Erscheinungsdatum :

    1990-02-01




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Strength analysis of the induction spot and full bonding processes

    Buser, J.E. / Shank, T.J. | Tema Archiv | 1990


    Strength analysis of the induction spot and full bonding process

    Buser,J.E. / Shank,T.J. / Robotron,US | Kraftfahrwesen | 1990