This discussion describes the relationships of the amount of paste deposited on a ceramic substrate by screening, to certain aspects of the screening process - - such as the mesh size, paste rheology, line width, etc. It is not intended to be a vigorous mathematical or mechanical analysis of the process.The conclusions can be extrapolated not only to an understanding of a part of the mechanism of paste transfer, but to a prediction of screened thickness - - as well as to methods for increasing the uniformity and thickness of screened images. Emulsion screens with stainless steel mesh and etched metal masks are discussed.
Paste Transfer in the Screening Process
Sae Technical Papers
Micro Electronic Packaging Conference ; 1968
1968-02-01
Aufsatz (Konferenz)
Englisch
Application of ink screening models to solder paste printing in SMT assembly
Online Contents | 1993
|Solder Paste Tests for the 'AART' Process
Online Contents | 1998
|Paste Propulsion of Space Transportation Vehicles for Orbital Transfer Applications
Springer Verlag | 2023
|SAE Technical Papers | 2005