This paper describes several new epoxy adhesives and bonding processes specifically developed for high volume, low cost automotive assembly operations. The applications include halogen-quartz headlamps; assembly of a variety of under-the-hood electrical and electronic components; a one component epoxy body solder used since 1971 to replace lead in the exposed body joints of taxicabs and other vehicles; and low temperature curing, flexible epoxy adhesives used to increase the strength of steel body joints of school buses and other “rivet bonded” structures.


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    Titel :

    Epoxy Adhesives for Automotive Assembly Operations


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    1980 Automotive Engineering Congress and Exposition ; 1980



    Erscheinungsdatum :

    1980-02-01




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Epoxy Adhesives for Automotive Assembly Operations

    Bolger,J.C. / Amicon,Lexington,US | Kraftfahrwesen | 1980


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