This paper describes several new epoxy adhesives and bonding processes specifically developed for high volume, low cost automotive assembly operations. The applications include halogen-quartz headlamps; assembly of a variety of under-the-hood electrical and electronic components; a one component epoxy body solder used since 1971 to replace lead in the exposed body joints of taxicabs and other vehicles; and low temperature curing, flexible epoxy adhesives used to increase the strength of steel body joints of school buses and other “rivet bonded” structures.
Epoxy Adhesives for Automotive Assembly Operations
Sae Technical Papers
1980 Automotive Engineering Congress and Exposition ; 1980
1980-02-01
Aufsatz (Konferenz)
Englisch
Buses , Thermoplastics , Drying , Headlamps , Adhesives and sealants , Steel , Resins , Joining , Assembling
Epoxy Adhesives for Automotive Assembly Operations
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