Grumman developed, patented, and tested a heat pipe concept to increase the power dissipation capability of the SEM FORMAT B Standard Module. The systems integration concept approach in the development of the design was to: Within the restraints of these objectives, the Grumman concept was shown to be feasible and proven to be capable of providing a power dissipation capability twice that of the existing conduction module.


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    Titel :

    Heat Pipe Cooled Electronic Circuit Card as Applied to SEM FORMAT B Standard


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    Intersociety Conference on Environmental Systems ; 1985



    Erscheinungsdatum :

    1985-07-01




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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