Grumman developed, patented, and tested a heat pipe concept to increase the power dissipation capability of the SEM FORMAT B Standard Module. The systems integration concept approach in the development of the design was to: Within the restraints of these objectives, the Grumman concept was shown to be feasible and proven to be capable of providing a power dissipation capability twice that of the existing conduction module.
Heat Pipe Cooled Electronic Circuit Card as Applied to SEM FORMAT B Standard
Sae Technical Papers
Intersociety Conference on Environmental Systems ; 1985
1985-07-01
Aufsatz (Konferenz)
Englisch
Heat pipe cooled rocket engines
NTRS | 1986
|Heat pipe cooled rocket engines
AIAA | 1986
|SAE Technical Papers | 2002
SAE Technical Papers | 2018