Multiscale micromechanics predictions have been made for the effective thermal conductivities and local thermal fields for a novel 3D woven composite thermal protection system material. The Multiscale Recursive Micromechanics approach, which enables micromechanics models to call other micromechanics models (or themselves recursively) to consider finer and finer length scales, has been employed. The multiscale model uses a recently developed version of the High-Fidelity Generalized Method of Cells micromechanics theory at each of three length scales. Results focus on the impact of the microstructural geometry representation at each length scale on the material’s effective thermal conductivity, along with the local thermal flux and temperature fields induced in the microstructures.


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    Titel :

    Thermal Conductivity of 3D Woven Composite Thermal Protection System Materials via Multiscale Recursive Micromechanics


    Beteiligte:
    Brett A Bednarcyk (Autor:in) / Trenton M Ricks (Autor:in) / Evan J Pineda (Autor:in) / Pappu L N Murthy (Autor:in) / Subodh K Mital (Autor:in) / Zhong Hu (Autor:in) / Peter A Gustafson (Autor:in)

    Kongress:

    AIAA SCITECH 2022 Forum ; 2022 ; San Diego, CA / Virtual, US



    Erscheinungsdatum :

    2021-12-29


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Keine Angabe


    Sprache :

    Englisch




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