The National Center for Microgravity Research, NASA Glenn Research Center, and NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. An improved understanding of the effects of the acceleration environment is important to application of soldering during current and future human space missions. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole and surface mounted devices are being investigated. This paper focuses on the experimental methodology employed in this project and the results of macroscopic sample examination. The specific soldering process, sample configurations, materials, and equipment were selected to be consistent with those currently on-orbit. Other apparatus was incorporated to meet requirements imposed by operation onboard NASA's KC-135 research aircraft and instrumentation was provided to monitor both the atmospheric and acceleration environments. The contingent of test operators was selected to include both highly skilled technicians and less skilled individuals to provide a population cross-section that would be representative of the skill mix that might be encountered in space mission crews.


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    Titel :

    Experimental Methods in Reduced-gravity Soldering Research


    Beteiligte:

    Kongress:

    Second International Brazing and Soldering Conference ; 2003 ; San Diego, CA, United States


    Erscheinungsdatum :

    2002-12-01


    Medientyp :

    Report


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


    Experimental Methods in Reduced-Gravity Soldering Research

    R. D. Pettegrew / P. M. Struk / J. K. Watson et al. | NTIS | 2002


    Soldering Alloys in Reduced Gravity - Solar

    Svedevall, A. / European Space Agency | British Library Conference Proceedings | 2013



    The Effects of an Unsteady Reduced Gravity Environment on the Soldering Process

    Struk, Peter / Pettegrew, Richard / Downs, Robert et al. | AIAA | 2004