For space flight hardware, the thermal vacuum environmental test is the best test of a system's flight worthiness. Substituting an atmospheric pressure thermal test for a thermal/vacuum test can effectively reduce piece part temperatures by 20 C or more, even for low power density designs. Similar reductions in test effectiveness can also result from improper assembly level T/V test boundary conditions. The net result of these changes may reduce the effective test temperatures to the point where there is zero or negative margin over the flight thermal environment.


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    Titel :

    Thermal/vacuum vs. thermal atmospheric testing of space flight electronic assemblies


    Beteiligte:
    Gibbel, Mark (Autor:in)


    Erscheinungsdatum :

    1990-11-01


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Keine Angabe


    Sprache :

    Englisch