This presentation is a NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond. This roadmap provides a snapshot for current plans and collaborations on testing and evaluation of electronics as well as a discussion of the technology selection approach.
NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond and Recent Radiation Highlights
2015
27 pages
Report
Keine Angabe
Englisch
Electrotechnology , Electronic packaging , Microprocessors , Reliability analysis , Reliability engineering , Systems-on-a-chip , Radiation hardening , Radiation measurement , Single event upsets , Protons , Heavy ions , Commercial off-the-shelf products , Cyclotrons , Field-programmable gate arrays , Field effect transistors , Systems engineering , Automobiles , Semiconductor devices , Space missions , Nasa space programs