This work describes the development and evaluation of advanced technologies for the integration of electronic die within membrane polymers. Specifically, investigators thinned silicon die, electrically connecting them with circuits on flexible liquid crystal polymer (LCP), using gold thermo-compression flip chip bonding, and embedding them within the material. Daisy chain LCP assemblies were thermal cycled from −135 to +85°C (Mars surface conditions for motor control electronics). The LCP assembly method was further utilized to embed an operational amplifier designed for operation within the Mars surface ambient. The embedded op-amp assembly was evaluated with respect to the influence of temperature on the operational characteristics of the device. Applications for this technology range from multifunctional, large area, flexible membrane structures to small-scale, flexible circuits that can be fit into tight spaces for flex to fit applications.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Advanced embedded active assemblies for extreme space applications


    Beteiligte:


    Erscheinungsdatum :

    2009-03-01


    Format / Umfang :

    1602337 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



    Flexible electronic assemblies for space applications

    Del Castillo, Linda / Moussessian, Alina / McPherson, Ryan et al. | IEEE | 2010


    Flexible Electronic Assemblies for Space Applications

    Del Castillo, L | Online Contents | 2010


    Advanced propeller assemblies

    GOLD HENRY JOYNER / GOLD STEVEN KENNETH | Europäisches Patentamt | 2021

    Freier Zugriff

    Advanced Propeller Assemblies

    GOLD HENRY JOYNER / GOLD STEVEN KENNETH | Europäisches Patentamt | 2020

    Freier Zugriff

    Extreme environment technologies for space and terrestrial applications

    Balint, Tibor S. / Cutts, James A. / Kolawa, Elizabeth A. et al. | SPIE | 2008