As a lightweight and low power alternative to the fiber-based RF-photonic components, photonic integrated circuits (PICs) are well suited for aerospace applications and, in particular, for free-space communications and remote sensing/imaging. In this work we present the design, fabrication, and space radiation testing of high-speed PICs as a means to elevate their technology readiness level (TRL) for avionics. Our efforts focus on improving the efficiency and bandwidth of thin-film lithium niobate and silicon-based devices as well as studying their envrionmental stability for aerospace applications. These devices will be compared between pre- and post-radiation silicon photonic devices for a space environment of near earth orbit.
Space test of photonic integrated materials and devices
2021-08-01
262533 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Space qualification of photonic devices
SPIE | 2002
|Space qualification of photonic devices
NTRS | 2002
|Semiconductor integrated devices for photonic routers
IEEE | 2002
|Germanium devices for integrated photonic circuits
SPIE | 2014
|Polyglass integrated photonic devices [3469-09]
British Library Conference Proceedings | 1998
|