We realized for the first time by a complete monolithic integration a bottom emitting laser OEIC including laser, monitor photodiode, and prism for SMT-packaging. This approach with the fabrication of the laser and reflection mirrors in full wafer technology exploits additionally the cost efficient advantages of on wafer facet preparation and on-wafer characterization.


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    Titel :

    Bottom emitting 1.3 /spl mu/m BH-FP laser with integrated 45/spl deg/ reflector and monitor photodiode


    Beteiligte:
    Janiak, K. (Autor:in) / Albrecht, P. (Autor:in) / Fidorra, S. (Autor:in) / Heidrich, H. (Autor:in) / Rehbein, W. (Autor:in) / Roehle, H. (Autor:in) / Althaus, H.-L. (Autor:in)


    Erscheinungsdatum :

    2002-01-01


    Format / Umfang :

    167066 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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