We realized for the first time by a complete monolithic integration a bottom emitting laser OEIC including laser, monitor photodiode, and prism for SMT-packaging. This approach with the fabrication of the laser and reflection mirrors in full wafer technology exploits additionally the cost efficient advantages of on wafer facet preparation and on-wafer characterization.
Bottom emitting 1.3 /spl mu/m BH-FP laser with integrated 45/spl deg/ reflector and monitor photodiode
2002-01-01
167066 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Bottom Emitting 1.3 mum BH-FP Laser with Integrated 45 degrees Reflector and Monitor Photodiode
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