A new paradigm for wafer inspection is being developed that would resolve many of today's pending wafer inspection issues. This paradigm integrates 1) a DRAM fabrication line simulation model, producing synthetic images of "typical" wafer maps and associated defects, to 2) fuzzy clustering/declustering algorithms that identify various defects and 3) a unique defect tracking mechanism to monitor patterns of defects across wafer maps. This approach holds promise for in-line process control by allowing for off-site analysis of fabrication line problems and unsupervised adaptation and optimization of application-specific inspection algorithms. The paper reports on the progress made towards the fulfilment of this paradigm.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Initial results on the development of a new wafer inspection paradigm


    Beteiligte:
    El Doker, T.A. (Autor:in) / King, J. (Autor:in) / Scott, D.R. (Autor:in)


    Erscheinungsdatum :

    2004-01-01


    Format / Umfang :

    431136 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



    Laser-based inspection improves wafer manufacture

    Zankowsky, D. | British Library Online Contents | 1998


    FlexRay - a new communication paradigm! - a new development paradigm?

    Nossal,R. / Dependable Computer Systems,DECOMSYS,AT | Kraftfahrwesen | 2004




    Container inspection project results

    British Library Online Contents | 1992