A packaging design providing "3D micro optical switching system (3D-MOSS)" is expected to reduce waveguide crossing points, system size and wiring distance drastically by using variable well optical integrated circuit (VWOIC).
3D micro optical switching system (3D-MOSS)-Packaging design
2001-01-01
205478 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
WM2 3D Micro Optical Switching System (3D-MOSS) -Packaging Design-
British Library Conference Proceedings | 2001
|Three-dimensional micro-optical switching system (3D-MOSS) architecture [4653-11]
British Library Conference Proceedings | 2002
|British Library Conference Proceedings | 2002
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