We have ablated holes in pre-thinned Si foils using an ultrafast laser. High resolution imaging of the edges of these holes reveal collateral damage limited to within 10 nanometers.
Confining collateral damage to less than 10 nm during femtosecond laser machining
Conference on Lasers and Electro-Optics, 2004. (CLEO). ; 1 ; 2 pp. vol.1
2004-01-01
301384 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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