Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.
Thermal management for light-emitting diodes
2017-05-23
Patent
Elektronische Ressource
Englisch
IPC: | F21V FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF , Funktionsmerkmale oder Einzelheiten von Leuchten oder Beleuchtungssystemen / B60Q ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL , Anordnung von Signal- oder Beleuchtungsvorrichtungen, deren Einbau oder Halterung oder deren Schaltkreise bei Fahrzeugen allgemein / F21K Nicht-elektrische Lichtquellen unter Verwendung von Lumineszenz , NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE / F21Y Index-Schema in Verbindung mit den Unterklassen F21K, F21L, F21S und F21V, betreffend die Form oder die Art der Lichtquellen oder die Farbe des emittierten Lichts , INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES |
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