The invention relates to a method for joining a power semiconductor component (1.1) to a heat pipe (2), wherein, during joining, the external pressure (p2) acting on the heat pipe (2) is changed proportionally to the internal pressure (p1) of the heat pipe (2), which internal pressure changes under heat during joining. The invention also relates to a device for carrying out the method, a power module, a converter and a vehicle.


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    Titel :

    SEMICONDUCTOR COMPONENT ON A HEAT PIPE


    Beteiligte:
    WALTRICH UWE (Autor:in)

    Erscheinungsdatum :

    2022-07-14


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES



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