A method eliminates voids in the bond line and manipulates a thickness of the bond line. This method includes: applying an adhesive at a center of an area of a structure; placing a doubler on the adhesive over the area of the structure, wherein the doubler has a peripheral edge; and maintaining a negative pressure at the peripheral edge of the doubler while simultaneously maintaining a positive pressure at the doubler to purge entrapped gases and control a thickness of the bond line at the peripheral edge of the doubler.
Double vacuum and positive pressure for paste bond joints
2024-06-18
Patent
Elektronische Ressource
Englisch
IPC: | B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B29L INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES , Index-Schema für besondere Gegenstände in Verbindung mit Unterklasse B29C / B64F GROUND OR AIRCRAFT-CARRIER-DECK INSTALLATIONS SPECIALLY ADAPTED FOR USE IN CONNECTION WITH AIRCRAFT , Boden- oder Flugzeugträgerdeckeinrichtungen besonders ausgebildet für die Verwendung in Verbindung mit Luftfahrzeugen |
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