A method for encapsulating electronic devices comprises, successively, placing a profiled strip on a conveyor belt, the profiled strip comprising a base, at least one flap protruding with respect to said base; positioning an electronic device, in the longitudinal direction, on the receiving zone of the profiled strip; and plastically deforming the flap by application of an application force in a predetermined direction.


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    Titel :

    Method for encapsulating electronic devices


    Beteiligte:

    Erscheinungsdatum :

    2024-04-09


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B29D PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE , Herstellen besonderer Gegenstände aus Kunststoff oder aus Stoffen in plastischem Zustand / B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B60C VEHICLE TYRES , Fahrzeugreifen / G06K Erkennen von Daten , RECOGNITION OF DATA



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