An electrical conveyance assembly includes a substrate that may include an electrically insulating material. The electrical conveyance assembly may include a plurality of electrical conductors connected to the substrate via additive manufacturing. The substrate may include an internal lattice structure formed via additive manufacturing. The substrate may include an internal fluid channel.


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    Titel :

    Electrical conveyance assembly


    Beteiligte:

    Erscheinungsdatum :

    2023-10-10


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B33Y ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING , Additive (generative) Fertigung, d. h. die Herstellung von dreidimensionalen [3D] Bauteilen durch additive Abscheidung, additive Agglomeration oder additive Schichtung, z. B. durch 3D- Drucken, Stereolithografie oder selektives Lasersintern / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT / G06K Erkennen von Daten , RECOGNITION OF DATA / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES



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