A substrate cutting device includes: a base portion; a stage on the base portion; a partition member spaced from the stage; and an exhausting structure below the cell substrate and configured to exhaust a gaseous substance. The stage has a top surface configured to support a cell substrate and a connection surface perpendicular to the top surface, and the partition member faces the connection surface and is configured to support the cell substrate.


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    Titel :

    Substrate cutting device


    Beteiligte:
    KIM WOONG (Autor:in) / KANG KYUNGWON (Autor:in) / KIM BUEMJOON (Autor:in) / KIM JIHOON (Autor:in) / KIM TEADONG (Autor:in) / NOH SUNGHO (Autor:in) / SIM JUNHO (Autor:in) / SHIM HYUNGBO (Autor:in) / LEE HEESUK (Autor:in) / HAN JAEKU (Autor:in)

    Erscheinungsdatum :

    2021-01-19


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B62D MOTOR VEHICLES , Motorfahrzeuge / B26D Schneiden , CUTTING



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