Polymer compositions having improved electromagnetic (EMI) shielding properties under high temperature are disclosed. The polymer compositions comprise a thermoplastic polymer, stainless steel fiber, and optionally one or more of glass fiber, a conductive filler, a second polymer, and other additives. The disclosed compositions maintain heat resistance and other mechanical properties under high temperatures.
Polymer compositions having improved EMI retention
2020-03-10
Patent
Elektronische Ressource
Englisch
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