A method of manufacturing a package, wherein the method comprises a forming a chip carrier by covering a thermally conductive and electrically insulating core on both opposing main surfaces thereof at least partially by a respective electrically conductive layer by brazing the respective electrically conductive layer on a respective one of the main surfaces; a mounting at least one electronic chip on the chip carrier; an electrically coupling an electrically conductive contact structure with the at least one electronic chip; and an encapsulating part of the electrically conductive contact structure, and at least part of the chip carrier and of the at least one electronic chip by a mold-type encapsulant.


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    Titel :

    Molded package with chip carrier comprising brazed electrically conductive layers


    Beteiligte:
    PAVIER MARK (Autor:in) / HABLE WOLFRAM (Autor:in) / KESSLER ANGELA (Autor:in) / SIELAFF MICHAEL (Autor:in) / PUGATSCHOW ANTON (Autor:in) / RIMBERT-RIVIERE CHARLES (Autor:in) / SOBKOWIAK MARCO (Autor:in)

    Erscheinungsdatum :

    2019-05-07


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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