Formulations comprising from 10 to 80% by weight of the formulation of a halogenated epoxy resin; from 1 to 15% by weight of the formulation of an antimony based fire retardant; from 1 to 10% by weight of the formulation of an inorganic or non-polymeric organic phosphorous containing fire retardant; and from 1 to 30% by weight of the formulation of a curative system are provided. The formulations are particularly suitable for producing aircraft interior composite components having good fire retarding properties, low smoke emission, low smoke toxicity and low heat release properties. The formulations also have excellent processing and mechanical properties. Further components may be included in the compositions to improve various properties, including the fire retarding, low smoke emission, low smoke toxicity and low heat release properties and to also further improve the processing and mechanical properties, including toughness. Compositions produced from the formulations have excellent processing and mechanical properties, and may also have good surface finishes.
エポキシ樹脂配合物
2024-02-02
Patent
Elektronische Ressource
Japanisch
IPC: | C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS , Massen auf Basis makromolekularer Verbindungen / B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM , Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse / B64C AEROPLANES , Flugzeuge / C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS , Makromolekulare Verbindungen, anders erhalten als durch Reaktionen, an denen nur ungesättigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind / C08J Verarbeitung , WORKING-UP / C08K Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe , USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS / C09K Materialien für Anwendungen, soweit nicht anderweitig vorgesehen , MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR |