The invention relates to a multi-layer heat insulation assembly internal deflating and discharging device. According to the multi-layer heat insulation assembly internal deflating and discharging device, a bottom layer is a thermal control film material represented by a polyimide film; an upper layer is a polytetrafluoroethylene pipeline with holes formed in the periphery, one end of the polytetrafluoroethylene pipeline exceeds the boundary of the polyimide film to be exposed, multiple layers are stacked, the uppermost layer is the polyimide film to form a sandwich structure, the periphery iscured and sealed by colloid, and the leading-out end of the polytetrafluoroethylene pipeline is led to the position of a non-sensitive surface of a spacecraft. According to the multi-layer heat insulation assembly internal deflating and discharging device, the contradictory problems of extremely high temperature control requirements and extremely high requirements on the control level of pollutants on the surface of a spacecraft thermal control material due to vacuum deflation of the thermal control material in an aerospace mission are solved; the colloid is used for sealing the edge strip ofthe thermal control assembly, punching in the surface of the thermal control assembly is canceled to seal gas outlet dissipation of internal materials, gas is guided out through a perforated guide pipe to keep balance of internal pressure and external pressure, and the leading-out end is guided to the non-sensitive position.

    本发明涉及一种多层隔热组件内部放气泄放装置,底层为以聚酰亚胺薄膜为代表的热控薄膜材料,上层为周身开孔的聚四氟乙烯管路,聚四氟乙烯管路一端超出聚酰亚胺薄膜边界外露,以此多层堆叠,最上层为聚酰亚胺薄膜,形成夹层结构,周边以胶体进行固化密封,并将聚四氟乙烯管路导出端引到航天器非敏感表面的位置;本发明解决在航天任务中,对温度控制要求极高,热控材料自身真空放气造成表面自污染与航天器热控材料表面污染物控制水平要求极高的矛盾问题;本发明通过使用胶体封闭热控组件边条,取消热控组件表面打孔,来封闭内部材料的出气逸散,通过开孔导管将气体导出保持内外压力平衡,并将导出端引到非敏感位置。


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    Titel :

    Multi-layer heat insulation assembly internal deflating and discharging device


    Weitere Titelangaben:

    一种多层隔热组件内部放气泄放装置


    Beteiligte:
    MOU YONGQIANG (Autor:in) / JIAO ZILONG (Autor:in) / YANG XIAONING (Autor:in) / LIU YUMING (Autor:in) / JIANG HAIFU (Autor:in) / TIAN DONGBO (Autor:in)

    Erscheinungsdatum :

    2020-10-02


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Chinesisch


    Klassifikation :

    IPC:    B64G Raumfahrt , COSMONAUTICS



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