Anisotropic materials have received remarkable attention in the development of microelectronic devices. In many materials, the thermal conductivities are temperature-dependent and usually are approximated by constant thermal conductivities when considering thermal analysis. In this paper, analytical solutions of the temperature rise and the thermal resistance of a multilayered three-dimensional flux channel with orthotropic temperature-dependent thermal conductivities are addressed by means of the Kirchhoff transform, which is considered as a powerful method for dealing with nonlinear conduction problems with temperature-dependent thermal conductivities. A single eccentric heat source is considered in the source plane of the flux channel, where heat enters the system and flows by conduction through the layers to reach a convective heat sink with uniform heat transfer coefficient. The solutions are extended to account for multiple eccentric heat sources in the source plane. Further, the analytical solutions have been validated by solving the problem numerically with the finite element method using the ANSYS commercial software package.
Spreading Resistance in Multilayered Orthotropic Flux Channel with Temperature-Dependent Thermal Conductivities
Journal of Thermophysics and Heat Transfer ; 32 , 2 ; 392-400
2017-12-27
9 pages
Aufsatz (Zeitschrift)
Elektronische Ressource
Englisch