A sensor for high-temperature applications is the thermocouple; however, this probe is characterized by errors due to convection, conduction, and radiation heat transfer to/from the sensing element. Experimental testing of total-temperature probes has been essential to identifying key design and performance parameters. With computational simulations that allow for detailed results, these performance parameters can be studied in depth. This work assesses the performance of total-temperature thermocouple probes with respect to measurement error sources, employing multiphysics, computational simulations. Using data from legacy and recent probe designs over a range of subsonic Mach numbers and temperatures, a computational tool is developed and validated to include the effects of conduction, convection, and radiation. Radiation errors are shown to be 50–150°R for the legacy probe at temperatures of 2000–2500°R. Heat transfer coefficients are tabulated as Nusselt numbers, and a new correlation for a shielded total-temperature probe is developed. The heat transfer at the probe tip is found to be three to five times higher than along the sides. The effect of a mounting strut is found to have a large effect on the internal flow patterns and probe performance. This work highlights the usefulness of computer simulations in the design and analysis of small total-temperature probes.


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    Titel :

    Computational Modeling of Total-Temperature Probes


    Beteiligte:
    Reardon, Jonathan (Autor:in) / Schetz, Joseph A. (Autor:in) / Lowe, K.Todd (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    2017-01-30


    Format / Umfang :

    12 pages




    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch




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