Dicing Laminated Wafer for QFN 3D Stacked Die Packaging
SYMPOSIUM D, Semiconductor photonics: nano-structured materials and devices ; 2007 ; Singapore
2008-01-01
4 pages
Includes bibliographical references and index; Held as part of the International conference on materials for advanced technologies (ICMAT) 2007
Aufsatz (Konferenz)
Englisch
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