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    Titel :

    2005-01-0864 An Approach to Predicting LED Junction Temperatures With Fluid and Thermal Analysis



    Kongress:

    Lighting technology and human factors ; 2005 ; Detroit, MI



    Erscheinungsdatum :

    2005-01-01


    Format / Umfang :

    8 pages


    Anmerkungen:

    Held as part of the 2005 SAE World Congress. Papers from a session of the SAE 2005 World Congress, Detroit, Mich. Includes bibliographic references.



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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