2005-01-0556 Enhanced Imager Chip Packaging for Automotive Applications
Systems engineering, electronics simulation, advanced electronics packaging, and electromagnetic compatibility ; 2005 ; Detroit, MI
Systems engineering, electronics simulation, advanced electronics packaging, and electromagnetic compatibility ; 1926 ; 7-16
SAE SP ; 1926
2005-01-01
10 pages
Held as a session of the SAE 2005 World Congress. Papers from a session of the SAE 2005 World Congress, Detroit, Mich. Includes bibliographic references.
Aufsatz (Konferenz)
Englisch
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