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    Titel :

    Comparing Substrate Solutions for Automotive Power Electronics Applications


    Beteiligte:

    Kongress:

    Sessions, Software/hardware systems, systems engineering, advanced electronics packaging, and electromagnetic compatibility (EMC); Software/hardware systems, systems engineering, advanced electronics packaging, and electromagnetic compatibility (EMC)



    Erscheinungsdatum :

    2004-01-01


    Format / Umfang :

    8 pages


    Anmerkungen:

    Held as part of the SAE 2004 world congress



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Comparing substrate solutions for automotive power electronics applications

    Fairchild, M.R. / Myers, J.D. / Badgett, J.L. et al. | Tema Archiv | 2004


    Comparing Substrate Solutions for Automotive Power Electronics Applications

    Berlin, Carl W. / Sarma, D.H.R. / Warren, Harold et al. | SAE Technical Papers | 2004


    Comparing substrate solutions for automotive power electronics applications

    Fairchild,M.R. / Myers,J.D. / Badgett,J.L. et al. | Kraftfahrwesen | 2004


    Comparing Substrate Solutions for Automotive Power Electronics Applications

    Fairchild, M. R. / Myers, J. D. / Badgett, J. L. et al. | British Library Conference Proceedings | 2004


    Reliable power electronics for automotive applications

    Seliger, N. / Wolfgang, E. / Lefranc, G. et al. | Tema Archiv | 2002