2002-01-1097 Evaluation of SoftMoun^S^M Technology for Use in Packaging Ultra Thinwall Ceramic Substrates
Sessions, Emissions modeling and general emissions ; 2002 ; Detroit, MI
2002-01-01
10 pages
Two Technical sessions. Held as part of the SAE 2002 world congress
Aufsatz (Konferenz)
Englisch
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