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    Titel :

    40-Gb/s IC and packaging technologies for future light wave communications (Invited Paper) [3038-24]


    Beteiligte:

    Kongress:

    Meeting, High-speed semiconductor lasers for communication ; 1997 ; San Jose; CA



    Erscheinungsdatum :

    1997-01-01


    Format / Umfang :

    12 pages




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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