Measurement of Die Stress in Advanced Electronic Packaging for Space and Terrestrial Applications
Conference; 2nd, Commercial development of space ; 1997 ; Albuquerque; NM
Commercial development of space ; 387//pt2 ; 819-824
AIP CONFERENCE PROCEEDINGS ; 387//pt2
1997-01-01
6 pages
Held as part of the space technology & applications international forum. Theme title: Looking forward: opening the space frontier
Aufsatz (Konferenz)
Englisch
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Terrestrial applications from space technology
NTRS | 1985
|Mobile Space Robots for Terrestrial Applications
NTRS | 2015
|Mobile Space Robots for Terrestrial Applications
NTIS | 2015
|