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    Titel :

    Test chip fabrication of 3D optically coupled common memory for parallel processing system (Invited Paper) [2400-02]


    Beteiligte:

    Kongress:

    Conference, Optoelectronic interconnects III ; 1995 ; San Jose; CA



    Erscheinungsdatum :

    1995-01-01


    Format / Umfang :

    8 pages




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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